Copper Clad Laminates
From universal CCLs for home electronics, semiconductors and network boards to eco-friendly halogen-free CCLs, our portfolio boasts an impressive range of products. Endowed with superior quality and technology, we are ready to position ourselves as a global leader in the electronics industry.
Material for Flexible PCBs
This material requires high resistance against repeated bending and suitability for compact, high parts mounting density PCBs in small electronic devices such as cellular phones, digital cameras and notebook PCs. This material enables high-density 3D interconnection by laminating thin films that offer superior resistance against heat, chemicals and flexural stress on copper clad.
Materials for Package Substrates
The materials for IC package substrates have a high elastic modulus and low CTE to provide reliable insulation and heat resistance properties, making them highly suitable for thin substrate applications.
Substrate Materials for Networks
Doosan Electronics manufactures copper clad laminates that offer low permittivity and a low dielectric dissipation factor. Low permittivity copper clad laminates are suitable for high frequency network boards, communication equipment, and high-speed data processing super-computers.
High Tg FR-4 Substrate Materials
Glass Epoxy Laminates, which are widely used in industrial equipment, have been further refined and are helping to promote sustainable economic growth in an environmentally-friendly way in accordance with ongoing changes in our life style, and are the basis on which numerous environmentally-friendly products including mobile applications, computer systems and car electronics have been developed and produced.
Halogen-free Substrate Materials
Highly reliable, eco-friendly materials for package substrates with low CET have been developed to meet the trend for thin, fine circuitry and high elastic modulus characteristics.
Heat Dissipation Materials
As the scope of application of electronic devices has been extended to the base substrate for LEDEs and high-voltage PCBs, PCB materials are required to equip them with effective heat dissipation and heat resistance properties.
Substrate Materials for Vehicle Electronics
This material requires high resistance against repeated bending and suitability for compact, high parts mounting density PCBs in small electronic devices such as cellular phones, digital cameras and notebook PCs. This material enables high-density 3D interconnection by laminating thin films that have superior resistance against heat, chemicals and flexural stress on copper clad.
CEM-3 Substrate Materials
The CEM-3 product group, realized by combining the superior performance of glass epoxy laminate with excellent workability, maximizes cost efficiency.
Standard FR-4 Substrate Materials
Glass Epoxy Laminates, which are widely used in industrial equipment, have been further refined and are helping to promote sustainable economic growth in an environmentally-friendly way in accordance with ongoing changes in our life style, and are the basis on which numerous environmentally-friendly products including mobile applications, computer systems and car electronics have been developed and produced.
Universal Substrate Materials
This is a product with universal applications consisting of CCL, glass web and glass fabric. DSE supplies the LED lighting apparatus, backlight unit and car electronics industries with high-quality CEM-3.
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