With the functionality and interconnection of small electronic products such as mobile phone, tablet PC, digital camera, notebook PC, and desktop PC becoming more important, the highly reliable FR-4 and flexible substrate materials are applied more widely to provide more design freedom for slim products.
The network substrate material is used by high-end routers, servers, and communication equipment with high transfer speed and low transfer loss at high frequency domain.
The IC package substrate is used for high elastic modulus and low CTE to support reliable and thin products with excellent insulation, heat resistance, low permittivity, and stretch stability.
The reliable substrate material with high radiation and high heat resistance is used for stability and life extension of control parts in LED lights (lighting, BLU, electric lamp, etc.) and high-voltage drive module.
The highly reliable FR-4 and flexible substrate material is applied to reduce the weight for expanding the IC parts and improving the fuel rating of smart automobiles and electrical control units (EV and HEV).
The CEM-3 substrate material used in home appliance products and LED light is a general-purpose electronic material that features maximum price efficiency by taking advantage of excellent FR-4 performance and processability.
