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Simulation Service

To improve the reliability of its electronic products, Doosan Electronics provides the simulation service of the modules and PCB process conditions applying the properties of copper clad laminates.

With mobile electronics such as smartphones and tablets recently becoming more popular and getting applied in more diverse fields than PCs, the processing speed of the required semiconductor components has increased, and the demand for large capacity is increasing while the overall size and weight are decreasing greatly. As a result, the warpage of package, printed circuit board (PCB), and copper clad laminate (CCL) products has emerged as a manufacturing issue, and the signal loss of substrate has become an important factor for increasing the process speed.

Multi-Physics Simulation for mechanical analysis and electrical analysis

Support for mechanical analysis of warpage and heat dissipation and electrical analysis of signal loss and impedance for semiconductor package, light emitting diode (LED), and PCB materials to which our substrate is applied.

Mechanical Simulation

  • Warpage Simulation

    Warpage Warpage
  • Heat Dissipation Simulation

    Heat dissipation Heat dissipation

Electrical Simulation

  • Signal loss & Impedance & Antenna Radiation

    Signal loss & Impedance Signal loss & Impedance

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Doosan Corporation Electro-Materials develops and produces a wide range of core materials for CRT TVs, cell phones, LCD, semiconductors and automobiles.

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