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Simulation Service

To improve the reliability of its electronic products, Doosan Electronics provides the simulation service of the modules and PCB process conditions applying the properties of copper clad laminates.

Simulation service for warpage analysis of ultra-thin plate package, PCB, and material-level CCL

Wafer Level Chip Scale Packaging (WLCSP), the packaging technology that stacks multiple layers of chips to reduce the footprint of semiconductor components, Flip Chip that connects the chips directly to PCB by using solder ball instead of wire, and package on package (POP) and multi-chip package (MCP) are widely used in the latest semiconductor packaging processes.
To be in step with the advancement of packaging technologies, Doosan Corporation Electro-Materials is focusing on the development of low coefficient of thermal expansion (CTE) and high glass transition temperature (Tg) products for CCL. The super-thin packages facilitated by its CCL have led to thinner epoxy molding compound (EMC) and Cu pattern density in PCB, and they greatly affect the warpage.
As such, Doosan Corporation Electro-Materials offers the warpage simulation service using the ANSYS work bench and the 3D Moire measurement service to measure the warpage according to the temperature profile.

Warpage simulation service of super-thin plate package, PCB, and CCL
– Linear analysis of structure by the material properties

  • Warpage analysis based on pattern density

    Warpage Simulation of Super-Thin Plate Package Warpage Simulation of Super-Thin Plate Package
  • Parametric warpage analysis by the material properties

    Simulation Based on Pattern Density Simulation Based on Pattern Density

Warpage simulation service of super-thin plate package, PCB, and CCL

  • Simulation process

    Structure of Package Strip / Modeling / Input Material property / Mesh study / Simulation & Analysis Structure of Package Strip / Modeling / Input Material property / Mesh study / Simulation & Analysis

Measurement of warpage by temperature profile using the Shadow Moiré system
– Measurement of structural warpage using the Shadow Moiré system

  • Measurement of structural warpage by temperature profile

    Package Strip Sample / Temperature Profile by Process / Measurement &  Analysis of Warpage Using 3D Moiré Package Strip Sample / Temperature Profile by Process / Measurement &  Analysis of Warpage Using 3D Moiré

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Doosan Corporation Electro-Materials develops and produces a wide range of core materials for CRT TVs, cell phones, LCD, semiconductors and automobiles.

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