CCL(Copper Clad Laminate)
제품 프로모션용 헤드 메시지 공간
Main Applications
- 5G/6G Communications - Small Cell
Features
- Low Dk & Df for high signal speed and signal integrity
- Excellent Multi-lamination and thermal performance
- Halogen, antimony and red phosphorus free
General Properties
| Parameter | Value | Unit | Condition | Test Method | ||
|---|---|---|---|---|---|---|
| Thermal | Tg (Glass Transition Temperature) |
DMA | 240 | ℃ | As received | IPC-TM-650 2.4.24.4 |
| TMA | 180 | ℃ | As received | IPC-TM-650 2.4.24C | ||
| Td (5% loss) (Decomposition Temperature) |
420 | ℃ | As received | IPC-TM-650 2.3.40 (TGA) |
||
| T-288 (Time to delamination) | >120 | min | As received | IPC-TM-650 2.4.24.1 | ||
| CTE | X Axis a1 | 13~14 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | |
| Y Axis a1 | 13~14 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | ||
| Z Axis a1 | 25~30 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
| Z Axis a2 | <200 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
| Thermal conductivity | 0.5 | W/m·K | As received | ASTM E 1461 | ||
| Z expansion | <1.6 | % | As received | IPC-TM-650 2.4.24.5 | ||
| Mechanical | Young's modulus | 25~26 | GPa | As received | IPC-TM-650 2.4.18.3 | |
| Peel strength | 0.8 (Hoz) | Kgf/cm | As Received /STD Toz |
IPC-TM-650 2.4.8C | ||
| Electrical | Dielectric constant (Dk) | 1GHz | 3.5 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 |
| 10GHz | 3.4 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.5 | ||
| Dissipation factor (Df) | 1GHz | 0.001 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 | |
| 10GHz | 0.0025 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.5 | ||
| Surface resistance | 1.00E+09 | MΩ | As received | IPC-TM-650 2.5.17.1A | ||
| Volume resistance | 1.00E+10 | MΩ/cm | As received | IPC-TM-650 2.5.17.1A | ||
| Others | Water Absorption | 0.12 | % | D-24h/23℃ | IPC-TM 2.6.2.1A | |
| Flammability Class | V-0 | - | - | UL94 | ||
RoHs Download
MSDS Download
