Doosan

Doosan Corporation participated in DesignCon 2022 in Santa Clara, California from April 5th to 7th.

Started since 1995, DesignCon is North America’s largest semiconductor, board, and systems event for industry leaders and major suppliers in network and communications. This year, more than 130 exhibitors took part in the event including semiconductor software companies like Cadence, and networking equipment solution providers, Amphenol, and Molex.

This year Doosan Corporation showcased its latest CCL for communication and networking equipment. The laminates feature low Dk and low Df characteristics which help reduce signal losses and transfer large volume of data fast and stably. In addition, improved processability and implementation of multilayer make suitable for wired/wireless communication equipment including server and base station.

CCL acts as an insulation material that prevents electrical leakage in printed circuit board (PCB), and types of resin, dielectric layer of CCL, determine performance of copper clad laminates.

Polytetrafluoroethylene (PTFE), which Doosan Corporation has recently adopted as a new resin material, is mostly used in aerospace and satellite thanks to ultra-low loss property. PTFE CCL is anticipated as a promising solution to network equipment in the future, especially for customers who want high-spec CCL for mmWave or 6G communications.

With fast growing 5G communications market, more customers in network business are looking for Doosan Corporation these days. The company is proactively responding to market demand by developing a wide range of high-quality products.