CCL(Copper Clad Laminate, 覆铜板/銅箔基板)
제품 프로모션용 헤드 메시지 공간
Main Applications
- Automotive - Sensor
Features
- Lower Df Dust free prepreg
- Excellent Thermal & Mechanical Properties under PCB Process
General Properties
| Parameter | Value | Unit | Condition | Test Method | ||
|---|---|---|---|---|---|---|
| Thermal | Tg (Glass Transition Temperature) |
DMA | 185 | ℃ | As received | IPC-TM-650 2.4.24.4 |
| TMA | 150 | ℃ | As received | IPC-TM-650 2.4.24C | ||
| Td (5% loss) (Decomposition Temperature) |
360 | ℃ | As received | IPC-TM-650 2.3.40 (TGA) |
||
| T-288 (Time to delamination) | 120 | min | As received | IPC-TM-650 2.4.24.1 | ||
| CTE | X Axis a1 | 23~26 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | |
| Y Axis a1 | 23~26 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | ||
| Z Axis a1 | 100~110 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
| Z Axis a2 | 350~400 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
| Thermal conductivity | 0.3~0.4 | W/m·K | As received | ASTM E 1461 | ||
| Mechanical | Young's modulus | 11~14 | GPa | As Received /STD Toz |
IPC-TM-650 2.4.18.3 | |
| Flexural strength | 400~450 | MPa | As Received /STD Toz |
IPC-TM-650 2.4.4B | ||
| Tensile strength | 220~240 | MPa | As Received /STD Toz |
IPC-TM-650 2.4.19C | ||
| Peel strength | 1.2 | Kgf/cm | As Received /STD Toz |
IPC-TM-650 2.4.8C | ||
| Elongation | 3.0~5.0 | % | As Received /STD Toz |
IPC-TM-650 2.4.19C | ||
| Density | 1.55~1.65 | g/㎤ | As Received /STD Toz |
- | ||
| Electrical | Dielectric constant (Dk) | 1GHz | 4.0 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 |
| Dissipation factor (Df) | 1GHz | 0.013 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 | |
| Surface resistance | >1.00E+06 ~ 1.00E+07 | MΩ | As received | IPC-TM-650 2.5.17.1A | ||
| Volume resistance | >1.00E+07 ~ 1.00E+08 | MΩ/cm | As received | IPC-TM-650 2.5.17.1A | ||
| Others | Water Absorption | 0.2~0.4 | % | D-24h/23℃ | IPC-TM 2.6.2.1A | |
| Flammability Class | V-0 | - | - | UL94 | ||
有害物质检测报告(RoHS) 下载
材料安全数据表(MSDS) 下载
