CCL(Copper Clad Laminate, 覆铜板/銅箔基板)
제품 프로모션용 헤드 메시지 공간
Main Applications
- Networks Equipment - Servers
- Networks Equipment - Enterprise/Carrier Router & Switch
- Networks Equipment - AI Accelerator
- 5G/6G Communications - Macro cell
- 5G/6G Communications - Small Cell
Features
- Halogen free
- Ultra low loss for 400G(N)
General Properties
| Parameter | Value | Unit | Condition | Test Method | ||
|---|---|---|---|---|---|---|
| Thermal | Tg (Glass Transition Temperature) |
DMA | 220 | ℃ | As received | IPC-TM-650 2.4.24.4 |
| TMA | 170 | ℃ | As received | IPC-TM-650 2.4.24C | ||
| Td (5% loss) (Decomposition Temperature) |
400 | ℃ | As received | IPC-TM-650 2.3.40 (TGA) |
||
| T-288 (Time to delamination) | >120 | min | As received | IPC-TM-650 2.4.24.1 | ||
| CTE | X Axis a1 | 12 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | |
| Y Axis a1 | 12 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | ||
| Z Axis a1 | 35 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
| Z Axis a2 | 200 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
| Thermal conductivity | 0.4 | W/m·K | As received | ASTM E 1461 | ||
| 0.7 | ASTM D 5470 | |||||
| Z expansion | 1.8 | % | As received | IPC-TM-650 2.4.24.5 | ||
| Mechanical | Peel strength | 1 | Kgf/cm | As Received /STD Toz |
IPC-TM-650 2.4.8C | |
| 0.8 | Kgf/cm | As Received /VLP Toz |
IPC-TM-650 2.4.8C | |||
| Electrical | Dielectric constant (Dk) | 1GHz | 3.04 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 |
| 10GHz | 2.95 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.5 | ||
| 3.1 | - | 24h/23℃/50% | SPDR | |||
| Dissipation factor (Df) | 1GHz | 0.0009 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 | |
| 10GHz | 0.0023 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.5 | ||
| 0.002 | - | 24h/23℃/50% | SPDR | |||
| Surface resistance | 1.00E+09 | MΩ | As received | IPC-TM-650 2.5.17.1A | ||
| Volume resistance | 1.00E+10 | MΩ/cm | As received | IPC-TM-650 2.5.17.1A | ||
| Others | Water Absorption | 0.08 | % | D-24h/23℃ | IPC-TM 2.6.2.1A | |
| Flammability Class | V-0 | - | - | UL94 | ||
有害物质检测报告(RoHS) 下载
材料安全数据表(MSDS) 下载
