CCL(Copper Clad Laminate, 覆铜板/銅箔基板)
제품 프로모션용 헤드 메시지 공간
Main Applications
- Networks Equipment - AI Accelerator
- Networks Equipment - Enterprise/Carrier Router & Switch
- 5G/6G Communications - Base Station
Features
- Halogen free
- Super Ultra Low Loss for 800G, AI Accelator
General Properties
| Property | Value | Unit | Condition | Test Method | ||
|---|---|---|---|---|---|---|
| Thermal | Tg (Glass Transition Temperature) |
DMA | 220 | ℃ | As received | IPC-TM-650 2.4.24.4 |
| TMA | 170 | ℃ | As received | IPC-TM-650 2.4.24C | ||
| Td (5% loss) (Decomposition Temperature) |
380 | ℃ | As received | IPC-TM-650 2.3.40 (TGA) |
||
| T-288 (Time to delamination) |
>120 | min | As received | IPC-TM-650 2.4.24.1 | ||
| CTE | X Axis a1 | 9 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | |
| Y Axis a1 | 9 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | ||
| Z Axis a1 | 25 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
| Z Axis a2 | 150 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
| Thermal conductivity | 0.7 | W/m·K | As received | ASTM D 5470 | ||
| Mechanical | Peel strength (HVLP3 1oz) | 0.5 | Kgf/cm | As Received | IPC-TM-650 2.4.24.5 | |
| Electrical | Dielectric constant (Dk) |
1GHz | 2.93 | - | RC 50% | IPC-TM-650 2.5.5.9 |
| 2.79 | - | RC 70% | IPC-TM-650 2.5.5.9 | |||
| 10GHz | 2.84 | - | RC 50% | IPC-TM-650 2.5.5.5 | ||
| 2.69 | - | RC 70% | IPC-TM-650 2.5.5.5 | |||
| Dissipation factor (Df) |
1GHz | 0.0004 | - | RC 50% | IPC-TM-650 2.5.5.9 | |
| 0.0004 | - | RC 70% | IPC-TM-650 2.5.5.9 | |||
| 10GHz | 0.0011 | - | RC 50% | IPC-TM-650 2.5.5.5 | ||
| 0.0011 | - | RC 70% | IPC-TM-650 2.5.5.5 | |||
| Surface Resistace | >1.00E+9 | MΩ | As Received | IPC-TM-650 2.5.17.1A | ||
| Volume Resistance | >1.00E+10 | MΩ/cm | As Received | IPC-TM-650 2.5.17.1A | ||
| Others | Water Absorption | 0.08 | % | D-24h/23℃ | IPC-TM 2.6.2.1A | |
| Flammability Class | V-0 | - | - | UL94 | ||
有害物质检测报告(RoHS) 下载
材料安全数据表(MSDS) 下载
