CCL(Copper Clad Laminate, 覆铜板/銅箔基板)
제품 프로모션용 헤드 메시지 공간
Main Applications
- Networks Equipment - Enterprise/Carrier Router & Switch
Features
- Low loss for 400G
General Properties
Parameter | Value | Unit | Condition | Test Method | ||
---|---|---|---|---|---|---|
Thermal | Tg (Glass Transition Temperature) |
DMA | 225 | ℃ | As received | IPC-TM-650 2.4.24.4 |
TMA | 180 | ℃ | As received | IPC-TM-650 2.4.24C | ||
DSC | 190 | ℃ | As received | IPC-TM-650 2.4.25C | ||
Td (5% loss) (Decomposition Temperature) |
400 | ℃ | As received | IPC-TM-650 2.3.40 (TGA) |
||
T-288 (Time to delamination) | >120 | min | As received | IPC-TM-650 2.4.24.1 | ||
CTE | X Axis a1 | 14 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | |
Y Axis a1 | 14 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | ||
Z Axis a1 | 40 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
Z Axis a2 | 220 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
Thermal conductivity | 0.4 | W/m·K | As received | ASTM E 1461 | ||
0.7 | ASTM D 5470 | |||||
Z expansion | <2.2 | % | As received | IPC-TM-650 2.4.24.5 | ||
Mechanical | Young's modulus | 22~24 | GPa | As received | IPC-TM-650 2.4.18.3 | |
Flexural strength | 450~470 | MPa | As received | IPC-TM-650 2.4.4B | ||
Peel strength | 1.2 | Kgf/cm | As Received /STD Toz |
IPC-TM-650 2.4.8C | ||
1 | Kgf/cm | As Received /VLP Toz |
IPC-TM-650 2.4.8C | |||
Electrical | Dielectric constant (Dk) | 1GHz | 3.09 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 |
10GHz | 3 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.5 | ||
3.1 | - | 24h/23℃/50% | SPDR | |||
Dissipation factor (Df) | 1GHz | 0.001 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 | |
10GHz | 0.0025 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.5 | ||
0.0037 | - | 24h/23℃/50% | SPDR | |||
Surface resistance | >1.00E+9 | MΩ | As received | IPC-TM-650 2.5.17.1A | ||
Volume resistance | >1.00E+10 | MΩ/cm | As received | IPC-TM-650 2.5.17.1A | ||
Others | Water Absorption | 0.12 | % | D-24h/23℃ | IPC-TM 2.6.2.1A | |
Flammability Class | V-0 | - | - | UL94 |
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