CCL(Copper Clad Laminate, 覆铜板/銅箔基板)
제품 프로모션용 헤드 메시지 공간
Main Applications
- Networks Equipment - Enterprise/Carrier Router & Switch
- Networks Equipment - AI Accelerator
- 5G/6G Communications - Base Station
Features
- High Tg, Low CTE, Mid Loss
- HDI processability
General Properties
| Parameter | Condition | Test Method | Unit | Value | ||
|---|---|---|---|---|---|---|
| Thermal | Tg (Glass Transition Temperature) |
DMA | As received | IPC-TM-650 2.4.24.4 | ℃ | 280 |
| DMA | As received | IPC-TM-650 2.4.24.2(film) | ℃ | |||
| TMA | As received | IPC-TM-650 2.4.24C | ℃ | 230 | ||
| DSC | As received | IPC-TM-650 2.4.25C | ℃ | |||
| Td (Decomposition Temperature) |
TGA 5% Loss | As received | IPC-TM-650 2.3.40 (TGA) |
℃ | 430 | |
| T-288 (Time to delamination) |
TMA | As received | IPC-TM-650 2.4.24.1 | min | 120 | |
| CTE | X Axis a1 | As received | IPC-TM-650 2.4.41.2 | ppm/℃ | 10 | |
| Y Axis a1 | As received | IPC-TM-650 2.4.41.2 | ppm/℃ | 10 | ||
| Z Axis a1 | As received | IPC-TM-650 2.4.24 | ppm/℃ | 20 | ||
| Z Axis a2 | As received | IPC-TM-650 2.4.24 | ppm/℃ | 120 | ||
| Thermal conductivity | As received | ASTM E 1461 | W/m·K | 0.6 | ||
| ASTM D 5470 | 0.8 | |||||
| Max. Operating Temperature | As received | UL 796 | ℃ | |||
| Z Expansion | As received | IPC-TM-650 2.4.24.5 | % | 1.3 | ||
| Young's Modulus | As received | IPC-TM-650 2.4.18.3 | GPa | 29~30 | ||
| Flexural Strength | As received | IPC-TM-650 2.4.4B | MPa | 450~500 | ||
| Storage Modulus | DMA | IPC-TM-650 2.4.24.4 | GPa | 29~30 | ||
| Tensile Strength | As Received | IPC-TM-650 2.4.18.3 | MPa | |||
| - | IPC-TM-650 2.4.19C | MPa | ||||
| Mechanical | Peel strength | As Received /STD Toz | IPC-TM-650 2.4.8C | Kgf/cm | ||
| As Received /STD 1oz | IPC-TM-650 2.4.8C | Kgf/cm | 1.0 | |||
| As Received /VLP Toz | IPC-TM-650 2.4.8C | Kgf/cm | ||||
| As Received /HVLP 1oz | IPC-TM-650 2.4.8C | Kgf/cm | 0.9 | |||
| As Received /HVLP3 1oz | IPC-TM-650 2.4.8C | Kgf/cm | ||||
| ED/RA, >12um(>Toz) | IPC-TM-650 2.4.9.1 | - | ||||
| Elongation | As Received | IPC-TM-650 2.4.19C | % | |||
| Dimensional Stability | After Etching (B-A) | IPC-TM-650 2.2.4C | % | |||
| After Heating (C-A) | IPC-TM-650 2.2.4C | % | ||||
| Density | - | - | g/cm3 | 1.6 | ||
| Poisson Ratio | - | - | - | 0.17~0.19 | ||
| Electrical | Dk (Dielectric Constant) |
1GHz | 2.5.5.9 | - | 3.44 | |
| SPDR | - | |||||
| 10GHz | 2.5.5.5 | - | 3.35 | |||
| SPDR | - | 3.4 | ||||
| Df (Dielectric Constant) |
1GHz | 2.5.5.9 | - | 0.005 | ||
| SPDR | - | |||||
| 10GHz | 2.5.5.5 | - | 0.007 | |||
| SPDR | - | 0.007 | ||||
| Surface Resistace | As Received | 2.5.17.1A | MΩ | >1.00E+9 | ||
| Volume Resistance | As Received | 2.5.17.1A | MΩ/cm | >1.00E+10 | ||
| Comparative Tracking Index | As Received | IEC 60112 | - | 3 | ||
| Dielectric Breakdown | AC | 2.5.6.2A | kV/mm | |||
| Others | Water Absorption | D-24h/23℃ | IPC-TM 2.6.2.1A | % | 0.15 | |
| D-2h/100℃ | - | % | ||||
| Flammability | - | UL94 | - | V-0 | ||
有害物质检测报告(RoHS) 下载
材料安全数据表(MSDS) 下载
