CCL(Copper Clad Laminate, 覆铜板/銅箔基板)
제품 프로모션용 헤드 메시지 공간
Main Applications
- IC Package - Memory - Mobile DRAM
Features
- Low Modulus & Low Tg
- Thin Thickness CCL(25μm), PPG(13μm)
- High Thermal Reliability (bHAST, TC)
제품 특성
| Parameter | Value | Unit | Condition | Test Method | ||
|---|---|---|---|---|---|---|
| Thermal | Tg (Glass Transition Temperature) |
DMA | 180 | ℃ | As received | IPC-TM-650 2.4.24.2 |
| Td (5% loss) (Decomposition Temperature) |
380 | ℃ | As received | IPC-TM-650 2.3.40 (TGA) |
||
| T-288 (Time to delamination) | >120 | min | As received | IPC-TM-650 2.4.24.1 | ||
| CTE | X Axis a1 | 2 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | |
| Y Axis a1 | 2 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | ||
| Z Axis a1 | 12 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
| Z Axis a2 | 50 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
| Thermal conductivity | 0.7 | W/m·K | As received | ASTM E 1461 | ||
| Mechanical | Young's modulus | 26 | GPa | As received | IPC-TM-650 2.4.18.3 | |
| Storage modulus | 28 | GPa | DMA | IPC-TM-650 2.4.24.4 | ||
| Peel strength | 0.8 | Kgf/cm | As Received /STD Toz |
IPC-TM-650 2.4.8C | ||
| Density | 2 | g/㎤ | - | - | ||
| Poisson ratio | 0.16 | - | - | - | ||
| Electrical | Dielectric constant (Dk) | 1GHz | 4.1 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 |
| 10GHz | 4 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.5 | ||
| Dissipation factor (Df) | 1GHz | 0.01 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 | |
| 10GHz | 0.011 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.5 | ||
| Surface resistance | >5.00E+7~5.00E+8 | MΩ | As received | IPC-TM-650 2.5.17.1A | ||
| Volume resistance | >1.00E+7~1.00E+8 | MΩ/cm | As received | IPC-TM-650 2.5.17.1A | ||
| Others | Water Absorption | 0.25 | % | D-24h/23℃ | IPC-TM 2.6.2.1A | |
| Flammability Class | V-0 | - | - | UL94 | ||
有害物质检测报告(RoHS) 下载
材料安全数据表(MSDS) 下载
