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CCL(Copper Clad Laminate, 覆铜板/銅箔基板)

제품 프로모션용 헤드 메시지 공간

Main Applications

  • Smart Device - Mobile
  • Smart Device - Consumer Electronics

Features

  • Lower Df Dust free prepreg
  • Excellent Thermal & Mechanical Properties
  • Variable thickness is available

General Properties

Parameter Value Unit Condition Test Method
Thermal Tg
(Glass Transition
Temperature)
DMA 200 As received IPC-TM-650 2.4.24.4
TMA 165 As received IPC-TM-650 2.4.24C
Td (5% loss)
(Decomposition Temperature)
400 As received IPC-TM-650 2.3.40
(TGA)
T-288 (Time to delamination) 20 min As received IPC-TM-650 2.4.24.1
CTE X Axis a1 19~23 ppm/℃ As received IPC-TM-650 2.4.41.2
Y Axis a1 19~23 ppm/℃ As received IPC-TM-650 2.4.41.2
Z Axis a1 70~100 ppm/℃ As received IPC-TM-650 2.4.24
Z Axis a2 350~400 ppm/℃ As received IPC-TM-650 2.4.24
Thermal conductivity 0.3 W/m·K As received ASTM E 1461
Mechanical Young's modulus 13~16 GPa As received IPC-TM-650 2.4.18.3
Flexural strength 320~370 MPa As received IPC-TM-650 2.4.4B
Tensile strength 180~220 MPa As received IPC-TM-650 2.4.19C
Peel strength 0.7 Kgf/cm As Received
/VLP Toz
IPC-TM-650 2.4.8C
Elongation 1.0~3.0 % As received IPC-TM-650 2.4.19C
Density 1.4~1.6 g/㎤ - -
Electrical Dielectric constant (Dk) 1GHz 3.3 - 24h/23℃/50% IPC-TM-650 2.5.5.9
10GHz 3.2 - 24h/23℃/50% IPC-TM-650 2.5.5.5
Dissipation factor (Df) 1GHz 0.003 - 24h/23℃/50% IPC-TM-650 2.5.5.9
10GHz 0.0039 - 24h/23℃/50% IPC-TM-650 2.5.5.5
Surface resistance 1.00E+06 As received IPC-TM-650 2.5.17.1A
Volume resistance 5.00E+06 MΩ/cm As received IPC-TM-650 2.5.17.1A
Dielectric breakdown >0.8 kV/mm AC IPC-TM-650 2.5.6.2A
Others Water Absorption 0.1~0.3 % D-24h/23℃ IPC-TM 2.6.2.1A
Flammability Class V-0 - - UL94

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