CCL(Copper Clad Laminate, 覆铜板/銅箔基板)
제품 프로모션용 헤드 메시지 공간
Main Applications
- Smart Device - Mobile
Features
- Good flexible endurance
- Good dimensional stability
- Excellent thermal resistance
- Available low profile & Hi-flex RA Copper
- Available of Low, Middle and High stiffness polyimide
General Properties
PI Thickness: 50 ㎛
Parameter | Value | Unit | Condition | Test Method | ||
---|---|---|---|---|---|---|
Thermal | Tg (Glass Transition Temperature) |
DMA | 330 | ℃ | As received | IPC-TM-650 2.4.24.2 |
Td (5% loss) (Decomposition Temperature) |
>500 | ℃ | As received | IPC-TM-650 2.3.40 (TGA) |
||
CTE | X Axis a1 | 22~25 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | |
X Axis a1 | 22~25 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | ||
Thermal conductivity | 0.2 | W/m·K | As received | ASTM E 1461 | ||
Max. operating temperature | 130 | ℃ | As received | UL 796 | ||
Mechanical | Young's modulus | 4.2 | GPa | As received | IPC-TM-650 2.4.18.3 | |
Tensile strength | 290 | MPa | - | IPC-TM-650 2.4.19C | ||
Peel strength | >1.2 | - | ED/RA, >12um(>Toz) |
IPC-TM-650 2.4.9.1 | ||
Elongation | 70 | % | As received | IPC-TM-650 2.4.19C | ||
Dimensional stability | After Etching | <±0.1 | % | After Etching (B-A) | IPC-TM-650 2.2.4C | |
After Heating | <±0.1 | % | After Heating (C-A) | IPC-TM-650 2.2.4C | ||
Density | 1.42 | g/㎤ | - | - | ||
Poisson ratio | 0.34 | - | - | - | ||
Electrical | Dielectric constant (Dk) | 1GHz | 3.4 | - | 24h/23℃/50% | SPDR |
10GHz | 3.3 | - | 24h/23℃/50% | SPDR | ||
Dissipation factor (Df) | 1GHz | 0.005 | - | 24h/23℃/50% | SPDR | |
10GHz | 0.007 | - | 24h/23℃/50% | SPDR | ||
Surface resistance | >1.00E+13 | MΩ | As received | IPC-TM-650 2.5.17.1A | ||
Volume resistance | >1.00E+14 | MΩ/cm | As received | IPC-TM-650 2.5.17.1A | ||
Dielectric breakdown | >5 | kV/mm | AC | IPC-TM-650 2.5.6.2A | ||
Comparative tracking index | 3 | - | As received | IEC 60112 | ||
Others | Water Absorption | 1.1 | % | D-24h/23℃ | IPC-TM 2.6.2.1A | |
Flammability Class | VTM-0 | - | - | UL94 |
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材料安全数据表(MSDS) 下载