CCL(Copper Clad Laminate, 覆铜板/銅箔基板)
제품 프로모션용 헤드 메시지 공간
Main Applications
- Smart Device - Mobile
Features
- Low Df Property
- Very High Temral Resistance
- Available Low loss copper (RA as well as ED)
- High transparency
General Properties
PI Thickness: 12 ㎛
| Parameter | Value | Unit | Condition | Test Method | ||
|---|---|---|---|---|---|---|
| Thermal | Tg (Glass Transition Temperature) |
DMA | 260 | ℃ | As received | IPC-TM-650 2.4.24.2 |
| Td (5% loss) (Decomposition Temperature) |
>480 | ℃ | As received | IPC-TM-650 2.3.40 (TGA) |
||
| CTE | X Axis a1 | 25~28 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | |
| X Axis a1 | 25~28 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | ||
| Thermal conductivity | 0.2 | W/m·K | As received | ASTM E 1461 | ||
| Max. operating temperature | 130 | ℃ | As received | UL 796 | ||
| Mechanical | Young's modulus | 7.7 | GPa | As received | IPC-TM-650 2.4.18.3 | |
| Tensile strength | 185 | MPa | - | IPC-TM-650 2.4.19C | ||
| Peel strength | >1 | - | ED/RA, >12um(>Toz) |
IPC-TM-650 2.4.9.1 | ||
| Elongation | 20 | % | As received | IPC-TM-650 2.4.19C | ||
| Dimensional stability | After Etching | <±0.1 | % | After Etching (B-A) | IPC-TM-650 2.2.4C | |
| After Heating | <±0.1 | % | After Heating (C-A) | IPC-TM-650 2.2.4C | ||
| Density | 1.42 | g/㎤ | - | - | ||
| Poisson ratio | 0.34 | - | - | - | ||
| Electrical | Dielectric constant (Dk) | 1GHz | 3.5 | - | 24h/23℃/50% | SPDR |
| 10GHz | 3.4 | - | 24h/23℃/50% | SPDR | ||
| Dissipation factor (Df) | 1GHz | 0.002 | - | 24h/23℃/50% | SPDR | |
| 10GHz | 0.0025 | - | 24h/23℃/50% | SPDR | ||
| Surface resistance | >1.00E+13 | MΩ | As received | IPC-TM-650 2.5.17.1A | ||
| Volume resistance | >1.00E+14 | MΩ/cm | As received | IPC-TM-650 2.5.17.1A | ||
| Dielectric breakdown | >5 | kV/mm | AC | IPC-TM-650 2.5.6.2A | ||
| Comparative tracking index | 3 | - | As received | IEC 60112 | ||
| Others | Water Absorption | 0.8 | % | D-24h/23℃ | IPC-TM 2.6.2.1A | |
| Flammability Class | VTM-0 | - | - | UL94 | ||
有害物质检测报告(RoHS) 下载
材料安全数据表(MSDS) 下载
