CCL(Copper Clad Laminate, 覆铜板/銅箔基板)
제품 프로모션용 헤드 메시지 공간
Main Applications
- 5G/6G Communications - Macro Cell
Features
- High Thermal conductivity
- Low Dk & Df
General Properties
| Parameter | Value | Unit | Condition | Test Method | ||
|---|---|---|---|---|---|---|
| Thermal | Tg (Glass Transition Temperature) |
DMA | 210 | ℃ | As received | IPC-TM-650 2.4.24.4 |
| TMA | 170 | ℃ | As received | IPC-TM-650 2.4.24C | ||
| Td (5% loss) (Decomposition Temperature) |
400 | ℃ | As received | IPC-TM-650 2.3.40 (TGA) |
||
| T-288 (Time to delamination) | >120 | min | As received | IPC-TM-650 2.4.24.1 | ||
| CTE | X Axis a1 | 13 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | |
| Y Axis a1 | 13 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | ||
| Z Axis a1 | 25 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
| Z Axis a2 | 100 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
| Thermal conductivity | 1 | W/m·K | As received | ASTM E 1461 | ||
| 1.2 | ASTM D 5470 | |||||
| Z expansion | 1.8 | % | As received | IPC-TM-650 2.4.24.5 | ||
| Mechanical | Peel strength | 15 | GPa | As received | IPC-TM-650 2.4.18.3 | |
| Storage modulus | 15 | GPa | DMA | IPC-TM-650 2.4.24.4 | ||
| Peel strength | 0.75 (HVLP Toz) |
Kgf/cm | As Received /VLP Toz |
IPC-TM-650 2.4.8C | ||
| Poisson ratio | 0.17 | - | - | - | ||
| Electrical | Dielectric constant (Dk) | 1GHz | 4.1 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 |
| 10GHz | 3.7 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.5 | ||
| 3.9 | - | 24h/23℃/50% | SPDR | |||
| Dissipation factor (Df) | 1GHz | 0.0012 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 | |
| 10GHz | 0.0025 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.5 | ||
| 0.0025 | - | 24h/23℃/50% | SPDR | |||
| Others | Water Absorption | 0.12 | % | D-24h/23℃ | IPC-TM 2.6.2.1A | |
| Flammability Class | V-0 | - | - | UL94 | ||
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