Doosan

Did you know that CTE mismatch issues are an extremply important factor to consider during semiconductor assembly?

If CTE is different between die, substrate, and motherboard, they behave differently in terms of warpage under reflow process, causing cracks at the end. 

Also, warpage is critical at the semiconductor and PCB assembly process due to 

- Die and substrate defect in terms of reliability 

- Image clarity problems of camera module image sensor

- Chip mounting defect at a SMT process

- PCB bow and twist and other mechanical errors 

Doosan Electro-Materials offers CCL with a range of CTE properties to help you minimize warpage issue and CTE mismatch. 

To learn more : https://www.doosanelectronics.com/kr/product/Copper_Clad_Laminate/DS-7409HG_ZL