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CCL(Copper Clad Laminate)

제품 프로모션용 헤드 메시지 공간

Main Applications

  • Automotive - RF Radar

Features

  • Ultra Low profile ED copper and Ultra Low Dielectric Loss.
  • Laminates can be used in applications up to 77 GHz
  • Non glass fabric laminate with Low modulus dielectric for anti-solder cracking.
  • Stable dielectric properties within temperature/frequency & minimized deviation.
  • Better/Wide range process window in hole making on PCB manufacturing.

General Properties

Parameter Value Unit Condition Test Method
Thermal Td (5% loss)
(Decomposition Temperature)
500 As received IPC-TM-650 2.3.40
(TGA)
T-288 (Time to delamination) >120 min As received IPC-TM-650 2.4.24.1
CTE X Axis a1 23 ppm/℃ As received IPC-TM-650 2.4.41.2
Y Axis a1 22 ppm/℃ As received IPC-TM-650 2.4.41.2
Z Axis a1 30 ppm/℃ As received IPC-TM-650 2.4.24
Thermal conductivity 0.5 W/m·K As received ASTM E 1461
Max. operating temperature 180 As received UL 796
Mechanical Young's modulus 0.8 GPa As received IPC-TM-650 2.4.18.3
Tensile strength 4.5 MPa As received IPC-TM-650 2.4.18.3
Peel strength 1 Kgf/cm As Received
/STD Toz
IPC-TM-650 2.4.8C
Elongation 80 % As received IPC-TM-650 2.4.19C
Dimensional stability After Etching -0.05 % After Etching (B-A) IPC-TM-650 2.2.4C
After Etching -0.09 % After Etching (C-A) IPC-TM-650 2.2.4C
Density 2.1 g/㎤ - -
Electrical Dielectric constant (Dk) 1GHz 3 - 24h/23℃/50% IPC-TM-650 2.5.5.9
10GHz 3 - 24h/23℃/50% IPC-TM-650 2.5.5.5
3 - 24h/23℃/50% SPDR
Dissipation factor (Df) 1GHz 0.0013 - 24h/23℃/50% IPC-TM-650 2.5.5.9
10GHz 0.001 - 24h/23℃/50% IPC-TM-650 2.5.5.5
0.001 - 24h/23℃/50% SPDR
Surface resistance 1.00E+14 As received IPC-TM-650 2.5.17.1A
Volume resistance 1.00E+15 MΩ/cm As received IPC-TM-650 2.5.17.1A
Others Water Absorption 0.05 % D-24h/23℃ IPC-TM 2.6.2.1A
0.05 % D-2h/100℃ -
Flammability Class V-0 - - UL94

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