CCL(Copper Clad Laminate)
제품 프로모션용 헤드 메시지 공간
Main Applications
- Smart Device - Mobile
- Smart Device - Consumer Electronics
Features
- Very Low Df, Excellent electrical performance
- Low CTE value and minimizes warpage in Non-G/F build-up materials
- Multiple lamination and high thermal reliability applications
- Suitable for HDI process
General Properties
Parameter | Value | Unit | Condition | Test Method | ||
---|---|---|---|---|---|---|
Thermal | Tg (Glass Transition Temperature) |
DMA | 190 | ℃ | As received | IPC-TM-650 2.4.24.2 |
Td (5% loss) (Decomposition Temperature) |
400 | ℃ | As received | IPC-TM-650 2.3.40 (TGA) |
||
T-288 (Time to delamination) | >120 | min | As received | IPC-TM-650 2.4.24.1 | ||
CTE | X Axis a1 | 25 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | |
Y Axis a1 | 25 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | ||
Z Axis a1 | 25 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
Z Axis a2 | 65 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
Thermal conductivity | 0.5 | W/m·K | As received | ASTM E 1461 | ||
Z expansion | 1 | % | As received | IPC-TM-650 2.4.24.5 | ||
Mechanical | Young's modulus | 10 | GPa | As received | IPC-TM-650 2.4.18.3 | |
Storage modulus | 10 | GPa | DMA | IPC-TM-650 2.4.24.4 | ||
Peel strength | 0.7 | Kgf/cm | As Received /VLP Toz |
IPC-TM-650 2.4.8C | ||
Density | 1.65~1.75 | g/㎤ | - | - | ||
Poisson ratio | 0.28 | - | - | - | ||
Electrical | Dielectric constant (Dk) | 1GHz | 3 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 |
10GHz | 3 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.5 | ||
Dissipation factor (Df) | 1GHz | 0.0022 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 | |
10GHz | 0.0025 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.5 | ||
Surface resistance | 1.00E+6~1.00E+7 | MΩ | As received | IPC-TM-650 2.5.17.1A | ||
Volume resistance | 1.00E+7~1.00E+8 | MΩ/cm | As received | IPC-TM-650 2.5.17.1A | ||
Dielectric breakdown | >30 | kV/mm | AC | IPC-TM-650 2.5.6.2A | ||
Others | Water Absorption | 0.25 | % | D-24h/23℃ | IPC-TM 2.6.2.1A | |
Flammability Class | V-0 | - | - | UL94 |
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