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CCL(Copper Clad Laminate)

제품 프로모션용 헤드 메시지 공간

Main Applications

  • Smart Device - Mobile
  • Smart Device - Consumer Electronics

Features

  • Very Low Df, Excellent electrical performance
  • Low CTE value and minimizes warpage in Non-G/F build-up materials
  • Multiple lamination and high thermal reliability applications
  • Suitable for HDI process

General Properties

Parameter Value Unit Condition Test Method
Thermal Tg
(Glass Transition Temperature)
DMA 190 As received IPC-TM-650 2.4.24.2
Td (5% loss)
(Decomposition Temperature)
400 As received IPC-TM-650 2.3.40
(TGA)
T-288 (Time to delamination) >120 min As received IPC-TM-650 2.4.24.1
CTE X Axis a1 25 ppm/℃ As received IPC-TM-650 2.4.41.2
Y Axis a1 25 ppm/℃ As received IPC-TM-650 2.4.41.2
Z Axis a1 25 ppm/℃ As received IPC-TM-650 2.4.24
Z Axis a2 65 ppm/℃ As received IPC-TM-650 2.4.24
Thermal conductivity 0.5 W/m·K As received ASTM E 1461
Z expansion 1 % As received IPC-TM-650 2.4.24.5
Mechanical Young's modulus 10 GPa As received IPC-TM-650 2.4.18.3
Storage modulus 10 GPa DMA IPC-TM-650 2.4.24.4
Peel strength 0.7 Kgf/cm As Received
/VLP Toz
IPC-TM-650 2.4.8C
Density 1.65~1.75 g/㎤ - -
Poisson ratio 0.28 - - -
Electrical Dielectric constant (Dk) 1GHz 3 - 24h/23℃/50% IPC-TM-650 2.5.5.9
10GHz 3 - 24h/23℃/50% IPC-TM-650 2.5.5.5
Dissipation factor (Df) 1GHz 0.0022 - 24h/23℃/50% IPC-TM-650 2.5.5.9
10GHz 0.0025 - 24h/23℃/50% IPC-TM-650 2.5.5.5
Surface resistance 1.00E+6~1.00E+7 As received IPC-TM-650 2.5.17.1A
Volume resistance 1.00E+7~1.00E+8 MΩ/cm As received IPC-TM-650 2.5.17.1A
Dielectric breakdown >30 kV/mm AC IPC-TM-650 2.5.6.2A
Others Water Absorption 0.25 % D-24h/23℃ IPC-TM 2.6.2.1A
Flammability Class V-0 - - UL94

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