CCL(Copper Clad Laminate)
제품 프로모션용 헤드 메시지 공간
Main Applications
- Memory Module & SSD
- Automotive - ECU / DCU / TCU
Features
- Low Modulus Halogen Free Material
- Solder crack reduction by Warpage control and soldering stress relaxation
- Halogen free and Antimony & Red phosphorus free
General Properties
| Parameter | Value | Unit | Condition | Test Method | ||
|---|---|---|---|---|---|---|
| Thermal | Tg (Glass Transition Temperature) |
DMA | 160~180 | ℃ | As received | IPC-TM-650 2.4.24.4 |
| Td (5% loss) (Decomposition Temperature) |
345~360 | ℃ | As received | IPC-TM-650 2.3.40 (TGA) |
||
| T-288 (Time to delamination) | >60 (260℃) | min | As received | IPC-TM-650 2.4.24.1 | ||
| CTE | X Axis a1 | 11~14 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | |
| Y Axis a1 | 11~14 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | ||
| Z Axis a1 | 90~140 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
| Z Axis a2 | 280~380 | ppm/℃ | As received | IPC-TM-650 2.4.24 | ||
| Thermal conductivity | 0.35~0.45 | W/m·K | As received | ASTM E 1461 | ||
| Mechanical | Young's modulus | 10~14 | GPa | As received | IPC-TM-650 2.4.18.3 | |
| Storage strength | 10~14 | GPa | DMA | IPC-TM-650 2.4.24.4 | ||
| Peel strength | 0.7~0.8 | Kgf/cm | As Received /VLP Toz |
IPC-TM-650 2.4.8C | ||
| Electrical | Dielectric constant (Dk) | 1GHz | 3.7 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 |
| 10GHz | 3.6 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.5 | ||
| Dissipation factor (Df) | 1GHz | 0.008 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.9 | |
| 10GHz | 0.009 | - | 24h/23℃/50% | IPC-TM-650 2.5.5.5 | ||
| Surface resistance | 1.00E+06 | MΩ | As received | IPC-TM-650 2.5.17.1A | ||
| Volume resistance | 5.00E+06 | MΩ/cm | As received | IPC-TM-650 2.5.17.1A | ||
| Dielectric breakdown | >0.8 | kV/mm | AC | IPC-TM-650 2.5.6.2A | ||
| Others | Water Absorption | 0.4~0.6 | % | D-24h/23℃ | IPC-TM 2.6.2.1A | |
| Flammability Class | V-0 | - | - | UL94 | ||
RoHs Download
MSDS Download
