Doosan

Doosan Corporation Electro-Materials is set to bring its high-performing material solutions to IPC APEX EXPO 2024, taking place from April 9 to 11 at the Anaheim Convention Center. The company will be showcasing its latest developments in laminates and prepregs for IC packing substrates, high-speed communications, and beyond 5G, 6G technology.

The company’s packaging materials are designed to meet the requirements of advanced packaging substrates, supporting fine-patterning and miniaturization in substrate designs. These materials are suitable for a range of applications, including memory semiconductor applications such as mobile and PC DRAM/NAND, and system semiconductor applications such as RF SiP, AiP, FC-CSP, and FC-BGA. Doosan Corporation Electro-Materials’ products are excellent for warpage control, thinness, and fine-pattern design.

In response to the growing demand for data processing, AI, IoT, and autonomous driving, Doosan Corporation Electro-Materials has introduced halogen-free, ultra-low loss laminates, DS-7409DQN, DS-7409DQN2, tailored to 800GbE wired network applications. These laminates enable large volumes of data transmission with minimal signal loss, making them ideal for use in switches and routers. The company is also showcasing its advanced high-speed materials for 1600GbE at the show.

As the telecom industry moves towards the development and commercialization of beyond 5G and 6G technology, which is expected to boost the AR/VR, autonomous driving, and urban air mobility (UAM) industries, Doosan Corporation Electro-Materials is ready to meet the challenge with its DS-9000 laminate. This new fluorinated resin-based, ultra-low Df/Dk (<0.0010/2.6 @10GHz) is suitable for beyond 5G and 6G technology, offering more signal efficiency compared to LCP and excellent PCB processability.

In addition, Doosan Corporation Electro-Materials is also showcasing its advanced HDI materials and glass-free RCC, featuring ultra-low loss and low CTE characteristics. These properties provide PCB design freedom while supporting stable signal transmission. The company’s range of FCCL is also on display, with the DSflex-600 series recommended for 5G antenna applications and the DSflex-900 series offering high flexibility and durability for use in the latest foldable form factors.

Doosan Corporation Electro-Materials’ exhibition at the IPC APEX EXPO 2024 promises to show how the company is connecting every aspect of our electronic lives.

About Doosan Corporation Electro-Materials

Doosan Corporation Electro-Materials is a global provider of copper clad laminates (CCL), a base material of advanced IC package substrates as well as printed circuit boards (PCB) for every electronics. Through technological innovation, we’re expanding our business areas beyond CCL to 5G mmWave communications, high-speed networks equipment, AI, and autonomous EVs.