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CCL(Copper Clad Laminate)

製品 프로모션용 헤드 메시지 공간

Main Applications

  • Smart Device - Mobile
  • Smart Device - Consumer Electronics

Features

  • Excellent Thermal Resistance
  • Excellent Dust Free Property under PCB Process
  • Halogen, antimony and red phosphorus free

General Properties

Parameter Value Unit Condition Test Method
Thermal Tg
(Glass Transition
Temperature)
DMA 185 As received IPC-TM-650 2.4.24.4
TMA 150 As received IPC-TM-650 2.4.24C
DSC 169 As received IPC-TM-650 2.4.25C
Td (5% loss)
(Decomposition Temperature)
360 As received IPC-TM-650 2.3.40
(TGA)
T-288 (Time to delamination) >20 min As received IPC-TM-650 2.4.24.1
CTE X Axis a1 18~21 ppm/℃ As received IPC-TM-650 2.4.41.2
Y Axis a1 18~21 ppm/℃ As received IPC-TM-650 2.4.41.2
Z Axis a1 90~100 ppm/℃ As received IPC-TM-650 2.4.24
Z Axis a2 350~400 ppm/℃ As received IPC-TM-650 2.4.24
Thermal conductivity 0.3~0.4 W/m·K As received ASTM E 1461
Max. operating temperature 130 As received UL 796
Z expansion 4.5~6.5 % As received IPC-TM-650 2.4.24.5
Mechanical Young's modulus 15~18 GPa As received IPC-TM-650 2.4.18.3
Flexural strength 350~400 MPa As received IPC-TM-650 2.4.4B
Storage modulus 12~14 GPa DMA IPC-TM-650 2.4.24.4
Tensile strength 200~230 MPa As received IPC-TM-650 2.4.19C
Peel strength 1 Kgf/cm As Received
/STD Toz
IPC-TM-650 2.4.8C
Elongation 3~5 % As received IPC-TM-650 2.4.19C
Density 1.55~1.65 g/㎤ - -
Poisson ratio 0.15~0.17 - - -
Electrical Dielectric constant (Dk) 1GHz 3.8 - 24h/23℃/50% IPC-TM-650 2.5.5.9
10GHz 3.7 - 24h/23℃/50% IPC-TM-650 2.5.5.5
Dissipation factor (Df) 1GHz 0.016 - 24h/23℃/50% IPC-TM-650 2.5.5.9
10GHz 0.017 - 24h/23℃/50% IPC-TM-650 2.5.5.5
Surface resistance >1.00E+6~1.00E+7 As received IPC-TM-650 2.5.17.1A
Volume resistance >1.00E+7~1.00E+8 MΩ/cm As received IPC-TM-650 2.5.17.1A
Dielectric breakdown >30 kV/mm AC IPC-TM-650 2.5.6.2A
Comparative tracking index 4 - As received IEC 60112
Others Water Absorption 0.2~0.4 % D-24h/23℃ IPC-TM 2.6.2.1A
Flammability Class V-0 - - UL94

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