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CCL(Copper Clad Laminate)

製品 프로모션용 헤드 메시지 공간

Main Applications

  • Smart Device - Mobile
  • Smart Device - Consumer Electronics
  • Memory Module & SSD
  • Automotive - ECU / DCU / TCU

Features

  • Ultra High Tg & Low CTE for warpage control material
  • High Speed material (Low Dk / Low loss)
  • Halogen, antimony and red phosphorus free

General Properties

Parameter Value Unit Condition Test Method
Thermal Tg
(Glass Transition
Temperature)
DMA 280 As received IPC-TM-650 2.4.24.2
TMA 230 As received IPC-TM-650 2.4.24C
Td (5% loss)
(Decomposition Temperature)
430 As received IPC-TM-650 2.3.40
(TGA)
T-288 (Time to delamination)
(T-288 with copper)
>120 min As received IPC-TM-650 2.4.24.1
CTE X Axis a1 10 ppm/℃ As received IPC-TM-650 2.4.41.2
Y Axis a1 9 ppm/℃ As received IPC-TM-650 2.4.41.2
Z Axis a1 20 ppm/℃ As received IPC-TM-650 2.4.24
Z Axis a2 120 ppm/℃ As received IPC-TM-650 2.4.24
Thermal conductivity 0.6 W/m·K As received ASTM E 1461
Max. operating temperature 130 As received UL 796
Z expansion 1.3 % As received IPC-TM-650 2.4.24.5
Mechanical Young's modulus 29~30 GPa As received IPC-TM-650 2.4.18.3
Peel strength 0.95 (Hoz) Kgf/cm As Received
/STD Toz
IPC-TM-650 2.4.8C
Density 1.96 g/㎤ - -
Poisson ratio 0.19~0.21 - - -
Electrical Dielectric constant (Dk) 1GHz 3.4 (RC 70%) - 24h/23℃/50% IPC-TM-650 2.5.5.9
10GHz 3.5 (RC 70%) - 24h/23℃/50% IPC-TM-650 2.5.5.5
Dissipation factor (Df) 1GHz 0.005 (RC 70%) - 24h/23℃/50% IPC-TM-650 2.5.5.9
10GHz 0.007 (RC 70%) - 24h/23℃/50% IPC-TM-650 2.5.5.5
Surface resistance >1.00E+8 As received IPC-TM-650 2.5.17.1A
Volume resistance >1.00E+9 MΩ/cm As received IPC-TM-650 2.5.17.1A
Dielectric breakdown >30 kV/mm AC IPC-TM-650 2.5.6.2A
Comparative tracking index 4 - As received IEC 60112
Others Water Absorption 0.15 % D-24h/23℃ IPC-TM 2.6.2.1A
Flammability Class V-0 - - UL94

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