CCL(Copper Clad Laminate)
製品 프로모션용 헤드 메시지 공간
Main Applications
- Networks Equipment - Servers
- 5G/6G Communication - 6G RIS/Antenna
Features
- Ultra Low profile ED copper and Ultra Low Dielectric Loss
- Excellent Dielectric property for Temperature & Moisture
- Low Water Absorption
- Available in Roll-type
General Properties
| Parameter | Value | Unit | Condition | Test Method | ||
|---|---|---|---|---|---|---|
| Thermal | Td (5% loss) (Decomposition Temperature) |
500 | ℃ | As received | IPC-TM-650 2.3.40 (TGA) |
|
| T-288 (Time to delamination) | >120 | min | As received | IPC-TM-650 2.4.24.1 | ||
| CTE | X Axis a1 | 11~20 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | |
| Y Axis a1 | 11~20 | ppm/℃ | As received | IPC-TM-650 2.4.41.2 | ||
| Mechanical | Young's modulus | 2~5 | GPa | As received | IPC-TM-650 2.4.18.3 | |
| Tensile modulus | 50~70 | MPa | As received | IPC-TM-650 2.4.18.3 | ||
| Peel strength | ≥1.0 | Kgf/cm | As Received /STD Toz |
IPC-TM-650 2.4.8C | ||
| Elongation | 2~3 | % | As received | IPC-TM-650 2.4.19C | ||
| Dimensional Stability | 0.1±0.1 | % | After Etching (B-A) |
IPC-TM-650 2.2.4C | ||
| 0.0±0.1 | % | After Etching (C-A) |
IPC-TM-650 2.2.4C | |||
| Electrical | Dielectric constant (Dk) | 1GHz | 2.6 | - | 24h/23℃/50% | SPDR | 10GHz | 2.6 | - | 24h/23℃/50% | SPDR |
| Dissipation factor (Df) | 1GHz | <0.001 | - | 24h/23℃/50% | SPDR | 10GHz | <0.001 | - | 24h/23℃/50% | SPDR |
| Surface resistance | 1.00E+14 | MΩ | As received | IPC-TM-650 2.5.17.1A | ||
| Volume resistance | 1.00E+15 | MΩ/cm | As received | IPC-TM-650 2.5.17.1A | ||
| Others | Water Absorption | 0.05 | % | D-24h/23℃ | IPC-TM 2.6.2.1A | |
| Flammability Class | V-0 | - | - | UL94 | ||
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