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CCL(Copper Clad Laminate)

製品 프로모션용 헤드 메시지 공간

Main Applications

  • Smart Device - Mobile

Features

  • High flexible endurance & Dimensional stability
  • Excellent thermal resistance
  • Easy to Imedance Control (with PI Thinckness up to 50um)
  • Available low profile & Hi-flex RA Copper
  • Available of Low, Middle and High stiffness polyimide
  • UL maximum operating temperature (MOT) 200℃

General Properties

PI Thickness: 25 ㎛

Parameter Value Unit Condition Test Method
Thermal Tg
(Glass Transition Temperature)
DMA 330 As received IPC-TM-650 2.4.24.2
Td (5% loss)
(Decomposition Temperature)
>500 As received IPC-TM-650 2.3.40
(TGA)
CTE X Axis a1 18~22 ppm/℃ As received IPC-TM-650 2.4.41.2
X Axis a1 18~22 ppm/℃ As received IPC-TM-650 2.4.41.2
Thermal conductivity 0.2 W/m·K As received ASTM E 1461
Max. operating temperature 200 As received UL 796
Mechanical Young's modulus 6.2 GPa As received IPC-TM-650 2.4.18.3
Tensile strength 390 MPa - IPC-TM-650 2.4.19C
Peel strength >1.2 - ED/RA,
>12um(>Toz)
IPC-TM-650 2.4.9.1
Elongation 65 % As received IPC-TM-650 2.4.19C
Dimensional stability After Etching <±0.1 % After Etching (B-A) IPC-TM-650 2.2.4C
After Heating <±0.1 % After Heating (C-A) IPC-TM-650 2.2.4C
Density 1.42 g/㎤ - -
Poisson ratio 0.34 - - -
Electrical Dielectric constant (Dk) 1GHz 3.5 - 24h/23℃/50% SPDR
10GHz 3.4 - 24h/23℃/50% SPDR
Dissipation factor (Df) 1GHz 0.005 - 24h/23℃/50% SPDR
10GHz 0.007 - 24h/23℃/50% SPDR
Surface resistance >1.00E+13 As received IPC-TM-650 2.5.17.1A
Volume resistance >1.00E+14 MΩ/cm As received IPC-TM-650 2.5.17.1A
Dielectric breakdown >5 kV/mm AC IPC-TM-650 2.5.6.2A
Comparative tracking index 3 - As received IEC 60112
Others Water Absorption 1.1 % D-24h/23℃ IPC-TM 2.6.2.1A
Flammability Class VTM-0 (12,20um) - - UL94

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